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Professor, Department of Ansys icepak 12 and Communication, Dr. ABSTRACT Present electronics industry component sizes are efficiently reducing to meet the product requirement with compact size with greater performance in compact size products resulting in different problems from thermal prospective to bring product better performance electrically and mechanically.
In this paper we will study how to overcome the thermal problem for a product which includes components reliability and PCB performance by using CFD thermal simulation tool Ansys Icepak. Over designing the system adds unnecessary cost and weight; under designing the system may lead to overheating and even system failure.
No single thermal analysis tool or technique works best in all situations. Good thermal assessments require a combination of analytical calculations using thermal specifications, empirical analysis and thermal modeling.
The art of thermal analysis involves using all available tools to support each other and validate their conclusions. Power devices and low lead count packages are the primary focus, but the concepts herein are general and can be applied to lower power components and higher lead count devices such as microcontrollers.
Heat will always be transferred from a hot medium to a cold medium, until equilibrium is reached. There must be a temperature difference The heat lost by the hot medium is equal to the amount of heat gained by the cold medium, except for losses to the surroundings.
Heat is the entity of interest being adverted carried Ansys icepak 12, and diffused dispersed. This can be contrasted with conductive heat transfer, which is the transfer of energy by vibrations at a molecular level 57 P a g e B. There are no cross currents perpendicular to the direction of flow, nor eddies or swirls of fluids.
In laminar flow the motion of the particles of fluid is very orderly with all particles moving in straight lines parallel to the pipe walls. In fluid dynamics, laminar flow is a flow regime characterized by high momentum diffusion and low momentum convection.
Natural convection Natural convection, or free convection, occurs due to temperature differences which affect the density, and thus relative buoyancy, of the fluid.
Heavier more dense components will fall, while lighter less dense components rise, leading to bulk fluid movement. Natural convection can only occur, therefore, in a gravitational field. A common example of natural convection is the rise of smoke from a fire.
Forced convection In forced convection, also called heat advection, fluid movement results from external surface forces such as a fan or pump.
Forced convection is typically used to increase the rate of heat exchange. Many types of mixing also utilize forced convection to distribute one substance within another.
Forced convection also occurs as a by-product to other processes, such as the action of a propeller in a fluid or aerodynamic heating. Fluid radiator systems, and also heating and cooling of parts of the body by blood circulation, are other familiar examples of forced convection.
Radiation Thermal radiation is energy emitted by matter as electromagnetic waves due to the pool of thermal energy that all matter possesses that has a temperature above absolute zero. Thermal radiation propagates without the presence of matter through the vacuum of space.
Thermal radiation is a direct result of the random movements of atoms and molecules in matter. Since these atoms and molecules are composed of charged particles protons and electronstheir movement results in the emission of electromagnetic radiation, which carries energy away from the surface.
This includes low momentum diffusion, high momentum Convection and rapid variation of pressure and velocity in space and time. Nobel Laureate Richard Feynman described turbulence as "the most important unsolved problem of classical physics" Flow in which the kinetic energy dies out due to the action of fluid molecular viscosity is called laminar flow.
While there is no theorem relating the nondimensional Reynolds number Re to turbulence flows at Reynolds numbers larger than are typically but not necessarily turbulent while those at low Reynolds numbers usually remain laminar. Printed circuit boards are used in virtually all but the simplest commercially produced electronic devices.
In informal use the term "PCB" is used both for bare and assembled boards, the context clarifying the meaning. It is a non conductive material to separate two copper sheets. Electronic components are discrete devices or discrete components, mostly industrial products and not to be confounded with electrical elements which are conceptual abstractions representing idealized electronic components.
Electronic components have two or more electrical terminals or leads. These leads connect, usually soldered to a printed circuit board to create an electronic circuit a discrete circuit with a particular function for example an amplifier, radio receiver or oscillator.
Basic electronic components may be packaged discretely as arrays or networks of like components or integrated inside of packages such as semiconductor integrated circuits, hybrid integrated circuits or thick film devices. The device will operate effectively within a specified temperature range which varies based on the device function and application context and ranges from the minimum operating temperature to the maximum operating temperature or peak operating temperature.ANSYS | Simulation Days EBU Technical Services, INAS SA thermal-structural using ANSYS Icepak and Mechanical * Pentru sesiunea Hands-on, este necesar laptop.
Licențele vor fi puse la dispoziție de către INAS. Licențele trebuiesc instalate înainte de seminar. Using Joints to Connect Line and Solid Bodies in the Mechanical application.
Join us for a two day event filled with the the latest news, tips & tricks from experts in simulation. Learn how to simulate faster, better & more accurate than ever before. Save the date - seats are limited! ANSYS Icepak is an integration electronics thermal analysis tool that allows engineers to predict the thermal footprint of anything from single chips all the way up to PCBs and even full data centers.
Icepak’s strength is in its ability to provide 1/18/ PM. ANSYS IcePak Project Package TZR file is an ANSYS IcePak Project Package. ANSYS Icepak is a powerful CAE software tool that enables engineers to model electronic system designs and performs heat transfer and fluid flow simulations on component-level, board-level, or system-level applications.5/5(31).
Using Joints to Connect Line and Solid Bodies in the Mechanical application.